📅 Oct 12, 2026
Satya Nadella unveiled the Maia 300 AI chip, calling it the company's biggest bet yet on its own silicon.
LexxWire
Maia 300 promises 40% better efficiency than leading GPU systems, with a chiplet design built on TSMC's N2P process.
LexxWire
Microsoft will scale Maia to multi-gigawatt deployments starting next year, making it the primary system for its own products.
LexxWire
Eight HBM4 stacks deliver 288GB of memory and 18 TB/s of bandwidth — built for long-context reasoning and agentic AI.
LexxWire
Reports say Microsoft is talking to TSMC about 300,000+ chips for 2027 delivery, aiming past one million units.
LexxWire
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